Visual inspection: Observe the components directly with the naked eye to check whether there are cracks, breakage, dents, scratches, dirt and other problems, and confirm whether the markings are clear and whether the pins are deformed.
Magnifying glass/microscope inspection: For some tiny components or defects that are difficult to detect with the naked eye, you can use a magnifying glass or microscope to observe, which can more clearly see the shape of the solder joints, the flatness of the pins and the tiny defects on the surface.
Dimension measurement: Use precision measuring tools such as vernier calipers and micrometers to measure the pin spacing and external dimensions of the components to ensure that they meet the specification requirements.
Parameter test: Use professional instruments such as multimeters and LCR impedance testers to measure the resistance, capacitance, inductance and other parameters of components such as resistors, capacitors, and inductors to determine whether they are within the specified error range.
Functional test: Connect the components to a specific circuit, apply the corresponding input signal, and detect whether its output meets the normal functional requirements. For example, input different logic signals to the logic gate circuit to check whether the output conforms to the logical relationship.
Withstand voltage test: A certain voltage is applied to the components through a withstand voltage tester to test whether they can withstand the voltage without breakdown, leakage, etc. within a specified time, so as to evaluate their insulation performance and withstand voltage capability.
Environmental test: The components are placed under specific environmental conditions such as high temperature, low temperature, high humidity, and salt spray to simulate the harsh environment they may encounter in actual use, observe their performance changes and appearance, and evaluate their environmental adaptability.
Aging test: The aging process of components is accelerated through high-temperature storage aging, high-low temperature cycle aging, high-temperature power aging, etc., to detect their performance stability after long-term use and discover potential early failure problems in advance.
Vibration and shock test: Vibration and shock stress are applied to components using equipment such as vibration tables and impact testers to test the firmness of their mechanical structure and the stability of their electrical performance, ensuring that they can withstand certain mechanical stress during transportation and use.
X-ray detection: X-rays are used to penetrate components to observe their internal structure, such as the welding quality of solder joints, the packaging of chips, and whether there are cracks inside.
Ultrasonic testing: Utilizes the reflection and refraction characteristics of ultrasonic waves when propagating inside components to detect internal defects such as delamination, pores, and cracks. It is especially suitable for detecting components with multilayer structures.
Magnetic particle testing: Mainly used to detect defects such as cracks on the surface and near the surface of components made of ferromagnetic materials. By applying magnetic powder on the surface of components, when there are defects, the magnetic powder will gather at the defects, thereby showing the location and shape of the defects.
Automated optical inspection (AOI): Use automatic optical inspection equipment to scan components through cameras, and use image processing technology and preset detection rules to quickly and accurately identify problems such as missing components, misinstallation, pin deformation, and solder joint defects.
Automated X-ray inspection (AXI): Automatically perform X-ray inspection on circuit boards and other components on the production line. It can detect internal defects that are difficult to detect with traditional visual inspection, improve detection efficiency and accuracy, and can be used for quality control in large-scale production.
Sampling inspection: According to a certain sampling plan, some samples are randomly selected from a batch of components for inspection, and the quality status of the entire batch of products is inferred based on the inspection results of the samples.
Statistical Process Control (SPC): By collecting, analyzing and monitoring key quality characteristic data in the production process, drawing statistical charts such as control charts, abnormal fluctuations in the production process can be discovered in a timely manner, and measures can be taken to make adjustments and improvements to ensure the stability of product quality.
