HIC-764-SST
Samtec Inc.
HIC-764-SST
Samtec Inc.
CONN IC DIP SOCKET 64POS GOLD
Reference Price (USD)
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$0.00000
500+
$0
1000+
$0
1500+
$0
2000+
$0
2500+
$0
Exquisite packaging
Discount
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HIC-764-SST
$0.00
Product details
Product Attributes
- Product Status: Obsolete
- Type: DIP, 0.75" (19.05mm) Row Spacing
- Number of Positions or Pins (Grid): 64 (2 x 32)
- Pitch - Mating: 0.070" (1.78mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 10.0µin (0.25µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Open Frame
- Termination: Solder
- Pitch - Post: 0.070" (1.78mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: 200.0µin (5.08µm)
- Contact Material - Post: Brass
- Housing Material: Polyester, Glass Filled
- Operating Temperature: -
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