BU200Z-178-HT
On Shore Technology Inc.
BU200Z-178-HT
On Shore Technology Inc.
CONN IC DIP SOCKET 20POS GOLD
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Exquisite packaging
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BU200Z-178-HT
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Product details
Product Attributes
- Product Status: Obsolete
- Type: DIP, 0.3" (7.62mm) Row Spacing
- Number of Positions or Pins (Grid): 20 (2 x 10)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 78.7µin (2.00µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Surface Mount
- Features: Open Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Copper
- Contact Finish Thickness - Post: Flash
- Contact Material - Post: Brass
- Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
- Operating Temperature: -55°C ~ 125°C
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