FI-XPB30SRL-HF11
JAE Electronics
FI-XPB30SRL-HF11
JAE Electronics
CONN RCPT 30P 0.039 GOLD SMD R/A
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FI-XPB30SRL-HF11
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Product details
Product Attributes
- Product Status: Obsolete
- Connector Type: Receptacle
- Contact Type: Non-Gendered
- Style: Board to Cable/Wire
- Number of Positions: 30
- Number of Positions Loaded: All
- Pitch - Mating: 0.039" (1.00mm)
- Number of Rows: 1
- Row Spacing - Mating: -
- Mounting Type: Board Edge, Cutout; Bottom Mount, Surface Mount, Right Angle, Reverse Mount
- Termination: Solder
- Fastening Type: Friction Lock
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 12.0µin (0.30µm)
- Insulation Color: Black
- Insulation Height: -
- Contact Length - Post: -
- Operating Temperature: -
- Material Flammability Rating: UL94 V-0
- Contact Finish - Post: Tin
- Mated Stacking Heights: -
- Ingress Protection: -
- Features: Grounding Pins, Shielded, Solder Retention
- Current Rating (Amps): -
- Voltage Rating: -
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