HSS08-B18-CP
CUI Devices
HSS08-B18-CP
CUI Devices
HEAT SINK, STAMPING, TO-218, 44.
Reference Price (USD)
1+
$2.00000
500+
$1.98
1000+
$1.96
1500+
$1.94
2000+
$1.92
2500+
$1.9
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
HSS08-B18-CP
$2.00
Product details
Product Attributes
- Product Status: Active
- Type: Board Level, Vertical
- Package Cooled: TO-218
- Attachment Method: PC Pin
- Shape: Square
- Length: 1.750" (44.45mm)
- Width: 1.750" (44.45mm)
- Diameter: -
- Fin Height: 0.492" (12.50mm)
- Power Dissipation @ Temperature Rise: 10.3W @ 75°C
- Thermal Resistance @ Forced Air Flow: 3.50°C/W @ 200 LFM
- Thermal Resistance @ Natural: 7.29°C/W
- Material: Aluminum Alloy
- Material Finish: Black Anodized
You May Also Be Interested In
