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HSE07-753045

CUI Devices
HSE07-753045 Preview
HSE07-753045
CUI Devices
HEAT SINK, EXTRUSION, TO-218/TO-
Reference Price (USD)
1+
$3.40000
500+
$3.366
1000+
$3.332
1500+
$3.298
2000+
$3.264
2500+
$3.23
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
HSE07-753045

HSE07-753045

$3.40

Product details

Product Attributes

  • Product Status: Active
  • Type: Board Level
  • Package Cooled: TO-218, TO-220
  • Attachment Method: Clip
  • Shape: Rectangular, Fins
  • Length: 2.953" (75.00mm)
  • Width: 1.181" (30.00mm)
  • Diameter: -
  • Fin Height: 1.772" (45.00mm)
  • Power Dissipation @ Temperature Rise: 15.46W @ 75°C
  • Thermal Resistance @ Forced Air Flow: 2.10°C/W @ 200 LFM
  • Thermal Resistance @ Natural: 4.85°C/W
  • Material: Aluminum Alloy
  • Material Finish: Black Anodized

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