HSE04-251265-2
CUI Devices
HSE04-251265-2
CUI Devices
HEAT SINK, EXTRUSION, TO-218/TO-
Reference Price (USD)
1+
$0.87000
500+
$0.8613
1000+
$0.8526
1500+
$0.8439
2000+
$0.8352
2500+
$0.8265
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
HSE04-251265-2
$0.87
Product details
Product Attributes
- Product Status: Active
- Type: Top Mount
- Package Cooled: TO-218, TO-220
- Attachment Method: Bolt On
- Shape: Rectangular, Fins
- Length: 0.984" (25.00mm)
- Width: 0.472" (12.00mm)
- Diameter: -
- Fin Height: 0.256" (6.50mm)
- Power Dissipation @ Temperature Rise: 2.47W @ 75°C
- Thermal Resistance @ Forced Air Flow: 16.60°C/W @ 200 LFM
- Thermal Resistance @ Natural: 30.38°C/W
- Material: Aluminum Alloy
- Material Finish: Black Anodized
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