HSE-B20250-040H-01
CUI Devices
HSE-B20250-040H-01
CUI Devices
HEAT SINK, EXTRUSION, TO-220, 25
Reference Price (USD)
1+
$0.79000
500+
$0.7821
1000+
$0.7742
1500+
$0.7663
2000+
$0.7584
2500+
$0.7505
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
Product details
Product Attributes
- Product Status: Active
- Type: Board Level, Vertical
- Package Cooled: TO-220
- Attachment Method: PC Pin
- Shape: Rectangular, Angled Fins
- Length: 0.984" (25.00mm)
- Width: 1.359" (34.50mm)
- Diameter: -
- Fin Height: 0.492" (12.50mm)
- Power Dissipation @ Temperature Rise: 5.5W @ 75°C
- Thermal Resistance @ Forced Air Flow: 4.44°C/W @ 200 LFM
- Thermal Resistance @ Natural: 13.64°C/W
- Material: Aluminum Alloy
- Material Finish: Black Anodized