HSB27-434316
CUI Devices
HSB27-434316
CUI Devices
HEAT SINK, BGA, 43.1 X 43.1 X 16
Reference Price (USD)
1+
$2.60000
500+
$2.574
1000+
$2.548
1500+
$2.522
2000+
$2.496
2500+
$2.47
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
HSB27-434316
$2.60
Product details
Product Attributes
- Product Status: Active
- Type: Top Mount
- Package Cooled: BGA
- Attachment Method: Adhesive
- Shape: Square, Pin Fins
- Length: 1.697" (43.10mm)
- Width: 1.697" (43.10mm)
- Diameter: -
- Fin Height: 0.650" (16.51mm)
- Power Dissipation @ Temperature Rise: 8.98W @ 75°C
- Thermal Resistance @ Forced Air Flow: 2.80°C/W @ 200 LFM
- Thermal Resistance @ Natural: 8.35°C/W
- Material: Aluminum Alloy
- Material Finish: Black Anodized
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