HSB21-454515
CUI Devices
HSB21-454515
CUI Devices
HEAT SINK, BGA, 45 X 45 X 15 MM
Reference Price (USD)
1+
$2.03000
500+
$2.0097
1000+
$1.9894
1500+
$1.9691
2000+
$1.9488
2500+
$1.9285
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
HSB21-454515
$2.03
Product details
Product Attributes
- Product Status: Active
- Type: Top Mount
- Package Cooled: BGA
- Attachment Method: Adhesive
- Shape: Square, Pin Fins
- Length: 1.772" (45.00mm)
- Width: 1.772" (45.00mm)
- Diameter: -
- Fin Height: 0.591" (15.00mm)
- Power Dissipation @ Temperature Rise: 9.9W @ 75°C
- Thermal Resistance @ Forced Air Flow: 2.80°C/W @ 200 LFM
- Thermal Resistance @ Natural: 7.56°C/W
- Material: Aluminum Alloy
- Material Finish: Black Anodized
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