HSB19-272718
CUI Devices
HSB19-272718
CUI Devices
HEAT SINK, BGA, 27 X 27 X 18 MM
Reference Price (USD)
1+
$1.93000
500+
$1.9107
1000+
$1.8914
1500+
$1.8721
2000+
$1.8528
2500+
$1.8335
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
HSB19-272718
$1.93
Product details
Product Attributes
- Product Status: Active
- Type: Top Mount
- Package Cooled: BGA
- Attachment Method: Adhesive
- Shape: Square, Pin Fins
- Length: 1.063" (27.00mm)
- Width: 1.063" (27.00mm)
- Diameter: -
- Fin Height: 0.709" (18.00mm)
- Power Dissipation @ Temperature Rise: 6.8W @ 75°C
- Thermal Resistance @ Forced Air Flow: 4.50°C/W @ 200 LFM
- Thermal Resistance @ Natural: 11.11°C/W
- Material: Aluminum Alloy
- Material Finish: Black Anodized
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