HSB17-404025
CUI Devices
HSB17-404025
CUI Devices
HEAT SINK, BGA, 40 X 40 X 25 MM
Reference Price (USD)
1+
$2.53000
500+
$2.5047
1000+
$2.4794
1500+
$2.4541
2000+
$2.4288
2500+
$2.4035
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
HSB17-404025
$2.53
Product details
Product Attributes
- Product Status: Active
- Type: Top Mount
- Package Cooled: BGA
- Attachment Method: Adhesive
- Shape: Square, Pin Fins
- Length: 1.575" (40.00mm)
- Width: 1.575" (40.00mm)
- Diameter: -
- Fin Height: 0.984" (25.00mm)
- Power Dissipation @ Temperature Rise: 11.7W @ 75°C
- Thermal Resistance @ Forced Air Flow: 2.10°C/W @ 200 LFM
- Thermal Resistance @ Natural: 6.41°C/W
- Material: Aluminum Alloy
- Material Finish: Black Anodized
You May Also Be Interested In