HSB15-404010
CUI Devices
HSB15-404010
CUI Devices
HEAT SINK, BGA, 40 X 40 X 10 MM
Reference Price (USD)
1+
$1.10858
500+
$1.0974942
1000+
$1.0864084
1500+
$1.0753226
2000+
$1.0642368
2500+
$1.053151
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
HSB15-404010
$1.11
Product details
Product Attributes
- Product Status: Active
- Type: Top Mount
- Package Cooled: BGA
- Attachment Method: Adhesive
- Shape: Square, Pin Fins
- Length: 1.575" (40.00mm)
- Width: 1.575" (40.00mm)
- Diameter: -
- Fin Height: 0.394" (10.00mm)
- Power Dissipation @ Temperature Rise: 6.3W @ 75°C
- Thermal Resistance @ Forced Air Flow: 3.90°C/W @ 200 LFM
- Thermal Resistance @ Natural: 11.84°C/W
- Material: Aluminum Alloy
- Material Finish: Black Anodized
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