HSB14-353518
CUI Devices
HSB14-353518
CUI Devices
HEAT SINK, BGA, 35 X 35 X 18 MM
Reference Price (USD)
1+
$1.65000
500+
$1.6335
1000+
$1.617
1500+
$1.6005
2000+
$1.584
2500+
$1.5675
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
HSB14-353518
$1.65
Product details
Product Attributes
- Product Status: Active
- Type: Top Mount
- Package Cooled: BGA
- Attachment Method: Adhesive
- Shape: Square, Pin Fins
- Length: 1.378" (35.00mm)
- Width: 1.378" (35.00mm)
- Diameter: -
- Fin Height: 1.378" (35.00mm)
- Power Dissipation @ Temperature Rise: 8.4W @ 75°C
- Thermal Resistance @ Forced Air Flow: 3.60°C/W @ 200 LFM
- Thermal Resistance @ Natural: 8.97°C/W
- Material: Aluminum Alloy
- Material Finish: Black Anodized
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