HSB09-212115
CUI Devices
HSB09-212115
CUI Devices
HEAT SINK, BGA, 21 X 21 X 15 MM
Reference Price (USD)
1+
$0.93000
500+
$0.9207
1000+
$0.9114
1500+
$0.9021
2000+
$0.8928
2500+
$0.8835
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
HSB09-212115
$0.93
Product details
Product Attributes
- Product Status: Active
- Type: Top Mount
- Package Cooled: BGA
- Attachment Method: Adhesive
- Shape: Square, Pin Fins
- Length: 0.827" (21.00mm)
- Width: 0.827" (21.00mm)
- Diameter: -
- Fin Height: 0.591" (15.00mm)
- Power Dissipation @ Temperature Rise: 4.3W @ 75°C
- Thermal Resistance @ Forced Air Flow: 6.00°C/W @ 200 LFM
- Thermal Resistance @ Natural: 17.39°C/W
- Material: Aluminum Alloy
- Material Finish: Black Anodized
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