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HSB08-212106

CUI Devices
HSB08-212106 Preview
HSB08-212106
CUI Devices
HEAT SINK, BGA, 21 X 21 X 6 MM
Reference Price (USD)
1+
$0.89000
500+
$0.8811
1000+
$0.8722
1500+
$0.8633
2000+
$0.8544
2500+
$0.8455
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
HSB08-212106

HSB08-212106

$0.89

Product details

Product Attributes

  • Product Status: Active
  • Type: Top Mount
  • Package Cooled: BGA
  • Attachment Method: Adhesive
  • Shape: Square, Pin Fins
  • Length: 0.827" (21.00mm)
  • Width: 0.827" (21.00mm)
  • Diameter: -
  • Fin Height: 0.236" (6.00mm)
  • Power Dissipation @ Temperature Rise: 3.0W @ 75°C
  • Thermal Resistance @ Forced Air Flow: 9.70°C/W @ 200 LFM
  • Thermal Resistance @ Natural: 25.40°C/W
  • Material: Aluminum Alloy
  • Material Finish: Black Anodized

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