HSB08-212106
CUI Devices
HSB08-212106
CUI Devices
HEAT SINK, BGA, 21 X 21 X 6 MM
Reference Price (USD)
1+
$0.89000
500+
$0.8811
1000+
$0.8722
1500+
$0.8633
2000+
$0.8544
2500+
$0.8455
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
HSB08-212106
$0.89
Product details
Product Attributes
- Product Status: Active
- Type: Top Mount
- Package Cooled: BGA
- Attachment Method: Adhesive
- Shape: Square, Pin Fins
- Length: 0.827" (21.00mm)
- Width: 0.827" (21.00mm)
- Diameter: -
- Fin Height: 0.236" (6.00mm)
- Power Dissipation @ Temperature Rise: 3.0W @ 75°C
- Thermal Resistance @ Forced Air Flow: 9.70°C/W @ 200 LFM
- Thermal Resistance @ Natural: 25.40°C/W
- Material: Aluminum Alloy
- Material Finish: Black Anodized
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