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HSB03-141406

CUI Devices
HSB03-141406 Preview
HSB03-141406
CUI Devices
HEAT SINK, BGA, 14 X 14 X 6 MM
Reference Price (USD)
1+
$0.74000
500+
$0.7326
1000+
$0.7252
1500+
$0.7178
2000+
$0.7104
2500+
$0.703
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
HSB03-141406

HSB03-141406

$0.74

Product details

Product Attributes

  • Product Status: Active
  • Type: Top Mount
  • Package Cooled: BGA
  • Attachment Method: Adhesive
  • Shape: Square, Pin Fins
  • Length: 0.551" (14.00mm)
  • Width: 0.551" (14.00mm)
  • Diameter: -
  • Fin Height: 0.236" (6.00mm)
  • Power Dissipation @ Temperature Rise: 2.1W @ 75°C
  • Thermal Resistance @ Forced Air Flow: 15.80°C/W @ 200 LFM
  • Thermal Resistance @ Natural: 35.98°C/W
  • Material: Aluminum Alloy
  • Material Finish: Black Anodized

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