HSB03-141406
CUI Devices
HSB03-141406
CUI Devices
HEAT SINK, BGA, 14 X 14 X 6 MM
Reference Price (USD)
1+
$0.74000
500+
$0.7326
1000+
$0.7252
1500+
$0.7178
2000+
$0.7104
2500+
$0.703
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
HSB03-141406
$0.74
Product details
Product Attributes
- Product Status: Active
- Type: Top Mount
- Package Cooled: BGA
- Attachment Method: Adhesive
- Shape: Square, Pin Fins
- Length: 0.551" (14.00mm)
- Width: 0.551" (14.00mm)
- Diameter: -
- Fin Height: 0.236" (6.00mm)
- Power Dissipation @ Temperature Rise: 2.1W @ 75°C
- Thermal Resistance @ Forced Air Flow: 15.80°C/W @ 200 LFM
- Thermal Resistance @ Natural: 35.98°C/W
- Material: Aluminum Alloy
- Material Finish: Black Anodized
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