BDN18-3CB/A01
CTS Thermal Management Products
BDN18-3CB/A01
CTS Thermal Management Products
HEATSINK CPU W/ADHESIVE 1.81"SQ
Reference Price (USD)
1+
$5.19000
500+
$5.1381
1000+
$5.0862
1500+
$5.0343
2000+
$4.9824
2500+
$4.9305
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
BDN18-3CB/A01
$5.19
Product details
Product Attributes
- Product Status: Active
- Type: Top Mount
- Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
- Attachment Method: Thermal Tape, Adhesive (Included)
- Shape: Square, Pin Fins
- Length: 1.810" (45.97mm)
- Width: 1.810" (45.97mm)
- Diameter: -
- Fin Height: 0.355" (9.02mm)
- Power Dissipation @ Temperature Rise: -
- Thermal Resistance @ Forced Air Flow: 3.50°C/W @ 400 LFM
- Thermal Resistance @ Natural: 10.80°C/W
- Material: Aluminum
- Material Finish: Black Anodized
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