BDN11-3CB/A01
CTS Thermal Management Products
BDN11-3CB/A01
CTS Thermal Management Products
HEATSINK CPU W/ADHESIVE 1.11"SQ
Reference Price (USD)
1+
$3.10000
500+
$3.069
1000+
$3.038
1500+
$3.007
2000+
$2.976
2500+
$2.945
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
BDN11-3CB/A01
$3.10
Product details
Product Attributes
- Product Status: Active
- Type: Top Mount
- Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
- Attachment Method: Thermal Tape, Adhesive (Included)
- Shape: Square, Pin Fins
- Length: 1.110" (28.19mm)
- Width: 1.110" (28.19mm)
- Diameter: -
- Fin Height: 0.355" (9.02mm)
- Power Dissipation @ Temperature Rise: -
- Thermal Resistance @ Forced Air Flow: 7.20°C/W @ 400 LFM
- Thermal Resistance @ Natural: 20.90°C/W
- Material: Aluminum
- Material Finish: Black Anodized
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