BDN10-3CB/A01
CTS Thermal Management Products
BDN10-3CB/A01
CTS Thermal Management Products
HEATSINK CPU W/ADHESIVE 1.01"SQ
Reference Price (USD)
1+
$2.83000
500+
$2.8017
1000+
$2.7734
1500+
$2.7451
2000+
$2.7168
2500+
$2.6885
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
BDN10-3CB/A01
$2.83
Product details
Product Attributes
- Product Status: Active
- Type: Top Mount
- Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
- Attachment Method: Thermal Tape, Adhesive (Included)
- Shape: Square, Pin Fins
- Length: 1.010" (25.65mm)
- Width: 1.010" (25.65mm)
- Diameter: -
- Fin Height: 0.355" (9.02mm)
- Power Dissipation @ Temperature Rise: -
- Thermal Resistance @ Forced Air Flow: 8.00°C/W @ 400 LFM
- Thermal Resistance @ Natural: 26.40°C/W
- Material: Aluminum
- Material Finish: Black Anodized
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