BDN09-3CB
CTS Thermal Management Products
BDN09-3CB
CTS Thermal Management Products
HEATSINK CPU .91" SQ
Reference Price (USD)
1+
$1.80000
500+
$1.782
1000+
$1.764
1500+
$1.746
2000+
$1.728
2500+
$1.71
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
BDN09-3CB
$1.80
Product details
Product Attributes
- Product Status: Active
- Type: Top Mount
- Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
- Attachment Method: Thermal Tape, Adhesive (Not Included)
- Shape: Square, Pin Fins
- Length: 0.910" (23.11mm)
- Width: 0.910" (23.11mm)
- Diameter: -
- Fin Height: 0.355" (9.02mm)
- Power Dissipation @ Temperature Rise: -
- Thermal Resistance @ Forced Air Flow: 9.60°C/W @ 400 LFM
- Thermal Resistance @ Natural: 26.90°C/W
- Material: Aluminum
- Material Finish: Black Anodized
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