48-3554-18
Aries Electronics
Product details
Product Attributes
- Product Status: Active
- Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
- Number of Positions or Pins (Grid): 48 (2 x 24)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Nickel Boron
- Contact Finish Thickness - Mating: 50.0µin (1.27µm)
- Contact Material - Mating: Beryllium Nickel
- Mounting Type: Through Hole
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Nickel Boron
- Contact Finish Thickness - Post: 50.0µin (1.27µm)
- Contact Material - Post: Beryllium Nickel
- Housing Material: Polyetheretherketone (PEEK), Glass Filled
- Operating Temperature: -55°C ~ 250°C