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1109681-314

Aries Electronics
1109681-314 Preview
1109681-314
Aries Electronics
CONN IC DIP SOCKET 14POS GOLD
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1109681-314

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Product details

Product Attributes

  • Product Status: Active
  • Type: DIP, 0.3" (7.62mm) Row Spacing
  • Number of Positions or Pins (Grid): 14 (2 x 7)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 10.0µin (0.25µm)
  • Contact Material - Mating: Brass
  • Mounting Type: Through Hole
  • Features: Spacer
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin-Lead
  • Contact Finish Thickness - Post: 200.0µin (5.08µm)
  • Contact Material - Post: Brass
  • Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
  • Operating Temperature: -

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