374324B60023G
Aavid, Thermal Division of Boyd Corporation
374324B60023G
Aavid, Thermal Division of Boyd Corporation
BGA HEAT SINK
Reference Price (USD)
1+
$3.48000
500+
$3.4452
1000+
$3.4104
1500+
$3.3756
2000+
$3.3408
2500+
$3.306
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
374324B60023G
$3.48
Product details
Product Attributes
- Product Status: Active
- Type: Board Level
- Package Cooled: BGA, FPGA
- Attachment Method: Solder Anchor
- Shape: Square, Pin Fins
- Length: 1.063" (27.00mm)
- Width: 1.063" (27.00mm)
- Diameter: -
- Fin Height: 0.394" (10.00mm)
- Power Dissipation @ Temperature Rise: 1.5W @ 50°C
- Thermal Resistance @ Forced Air Flow: 6.00°C/W @ 500 LFM
- Thermal Resistance @ Natural: 30.60°C/W
- Material: Aluminum
- Material Finish: Black Anodized
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