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218-7223-55-1902

3M
218-7223-55-1902 Preview
218-7223-55-1902
3M
CONN SOCKET SOIC 18POS GOLD
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218-7223-55-1902

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Product details

Product Attributes

  • Product Status: Active
  • Type: SOIC
  • Number of Positions or Pins (Grid): 18 (2 x 9)
  • Pitch - Mating: -
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: -
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Closed Frame
  • Termination: Solder
  • Pitch - Post: -
  • Contact Finish - Post: Gold
  • Contact Finish Thickness - Post: 30.0µin (0.76µm)
  • Contact Material - Post: Beryllium Copper
  • Housing Material: Polyethersulfone (PES), Glass Filled
  • Operating Temperature: -55°C ~ 150°C

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